1. ITekhnoloji yePhysical Micromachining
I-Laser Beam Machining: Inkqubo esebenzisa i-laser beam-directed-directed thermal energy ukususa izinto ezivela kwintsimbi okanye i-non-metallic surface, ifaneleke kangcono izinto ezinqabileyo ezinombane ophantsi, kodwa zingasetyenziselwa izinto ezininzi.
Ukusetyenzwa kwe-Ion beam: ubuchule obubalulekileyo bokwenza into engavumelekanga kwi-micro/nano fabrication.Isebenzisa ukuhamba kweeyoni ezikhawulezayo kwigumbi lokufunxa ukususa, ukongeza okanye ukuguqula iiathomu kumphezulu wento.
2. Itekhnoloji ye-Chemical micromachining
I-Reactive Ion Etching (RIE): yinkqubo yeplasma apho iintlobo zivuyiswa yi-radio frequency discharge ukuze kufakwe i-substrate okanye ifilimu encinci kwigumbi loxinzelelo oluphantsi.Yinkqubo ye-synergistic yeentlobo zekhemikhali ezisebenzayo kunye nokubhobhoza kwee-ion eziphezulu zamandla.
I-Electrochemical Machining (ECM): Indlela yokususa isinyithi ngokusebenzisa inkqubo ye-electrochemical.Ngokuqhelekileyo isetyenziselwa ukuvelisa ubuninzi bezinto eziphathekayo ezinzima kakhulu okanye izinto ekunzima ukuzisebenzisa ngeendlela eziqhelekileyo.Ukusetyenziswa kwayo kunqunyelwe kwizinto zokuqhuba.I-ECM inokusika ii-angles ezincinci okanye ezineprofayili, iicontours ezintsonkothileyo okanye imingxuma kwiintsimbi ezinzima nezinqabileyo.
3. Iteknoloji ye-micromachining yomatshini
Ukujika kweDayimane:Inkqubo yokuguqula okanye ukwenza amacandelo achanekileyo usebenzisa iileyile okanye oomatshini abaphumayo abaxhotyiswe ngeengcebiso zedayimane zendalo okanye ezenziweyo.
Ukugaya Idayimani:Inkqubo yokusika engasetyenziselwa ukuvelisa i-aspheric lens arrays usebenzisa isixhobo sedayimane esiyingqukuva ngokusebenzisa indlela yokusika indandatho.
UkuSila ngokuchanekileyo:Inkqubo ye-abrasive evumela ukuba ii-workpieces zenziwe ngoomatshini ukuya kumphezulu ocolekileyo kunye nokunyamezelana okusondele kakhulu kwi-0.0001" yokunyamezela.
Ukugudisa:Inkqubo ye-abrasive, i-argon ion beam polishing yinkqubo ezinzile ngokufanelekileyo yokugqiba izipili zeteleskopu kunye nokulungisa iimpazamo ezishiyekileyo ezivela kumatshini wokugulisa okanye i-diamond-turned optics, inkqubo ye-MRF yayiyinkqubo yokuqala yokugudisa.Intengiso kwaye isetyenziselwa ukuvelisa iilensi ze-aspherical, izibuko, njl.
3. Itekhnoloji yeLaser micromachining, enamandla ngaphaya kombono wakho
Le mingxuma kwimveliso ineempawu zobukhulu obuncinci, inombolo exineneyo, kunye nokuchaneka okuphezulu kokucubungula.Ngamandla ayo aphezulu, ulwalathiso oluhle kunye nokuhambelana, iteknoloji ye-laser micromachining inokujolisa i-laser beam ibe yi-microns ezimbalwa ububanzi ngokusebenzisa inkqubo ethile ye-optical system.Indawo yokukhanya inoxinzelelo oluphezulu kakhulu loxinzelelo lwamandla.Izinto eziphathekayo ziya kufikelela ngokukhawuleza kwindawo yokuncibilika kwaye zinyibilike zibe yi-melted.Ngesenzo esiqhubekayo selaser, inyibilika iya kuqala ukufunxa, ibangele umaleko ocolekileyo womphunga, wenze imeko apho umphunga, oqinileyo kunye nolwelo luhlala khona.
Ngeli xesha, ngenxa yempembelelo yoxinzelelo lwe-steam, i-melt iya kutshizwa ngokuzenzekelayo, yenze ukubonakala kokuqala komngxuma.Njengoko ixesha lokukhanya kwe-laser beam lisanda, ubunzulu kunye nobubanzi be-microspores buqhubeka bukhula de i-laser irradiation ipheliswe ngokupheleleyo, kwaye inyibiliko engakhange itshizwe iya kuqina ukwenza umaleko wokuphinda uyilwe, ukuze kufezekiswe umqa welaser ongalungiswanga.
Ngokunyuka kwemfuno ye-micromachining yeemveliso ezichanekileyo kunye namacandelo oomatshini kwimarike, kunye nophuhliso lwetekhnoloji ye-laser micromachining iya isiba ngabantu abaqolileyo, itekhnoloji ye-laser micromachining ixhomekeke kwiingenelo zayo eziphambili zokusetyenzwa, ukusebenza kakuhle okuphezulu kunye nezixhobo eziphathwayo.Izibonelelo zothintelo oluncinci, akukho monakalo womzimba, kunye nokulawula okuhlakaniphile kunye nokuguquguqukayo kuya kusetyenziswa ngokubanzi ekuqhutyweni kweemveliso ezichanekileyo kunye neziyinkimbinkimbi.
Ixesha lokuposa: Sep-26-2022